demetallization process
金属化去除过程
undergoing demetallization
正在进行金属化去除
prevent demetallization
防止金属化去除
demetallization study
金属化去除研究
post-demetallization treatment
金属化去除后处理
demetallization effect
金属化去除效果
accelerate demetallization
加速金属化去除
demetallization analysis
金属化去除分析
initial demetallization
初始金属化去除
complete demetallization
完全金属化去除
the circuit board underwent demetallization during the harsh environmental testing.
电路板在恶劣的环境测试中经历了金属去除过程。
demetallization of the silicon wafer can significantly impact device performance.
硅片的金属去除会对器件性能产生重大影响。
preventing demetallization is crucial for long-term reliability in microelectronics.
防止金属去除对于微电子产品长期可靠性至关重要。
we studied the mechanisms behind demetallization in aluminum interconnects.
我们研究了铝互连中金属去除的机制。
demetallization can be accelerated by elevated temperatures and humidity.
高温和高湿度会加速金属去除过程。
the passivation layer helps to mitigate demetallization effects on the surface.
钝化层有助于减轻表面金属去除的影响。
post-etch demetallization is a common concern in semiconductor manufacturing.
蚀刻后的金属去除是半导体制造中常见的担忧。
understanding demetallization pathways is key to designing robust devices.
理解金属去除途径是设计坚固型器件的关键。
demetallization testing is a standard procedure in our quality control process.
金属去除测试是我们质量控制流程的标准程序。
the goal is to minimize demetallization and extend the device lifespan.
目标是尽量减少金属去除并延长器件寿命。
electromigration can contribute to demetallization in integrated circuits.
电子迁移可导致集成电路中的金属去除。
demetallization process
金属化去除过程
undergoing demetallization
正在进行金属化去除
prevent demetallization
防止金属化去除
demetallization study
金属化去除研究
post-demetallization treatment
金属化去除后处理
demetallization effect
金属化去除效果
accelerate demetallization
加速金属化去除
demetallization analysis
金属化去除分析
initial demetallization
初始金属化去除
complete demetallization
完全金属化去除
the circuit board underwent demetallization during the harsh environmental testing.
电路板在恶劣的环境测试中经历了金属去除过程。
demetallization of the silicon wafer can significantly impact device performance.
硅片的金属去除会对器件性能产生重大影响。
preventing demetallization is crucial for long-term reliability in microelectronics.
防止金属去除对于微电子产品长期可靠性至关重要。
we studied the mechanisms behind demetallization in aluminum interconnects.
我们研究了铝互连中金属去除的机制。
demetallization can be accelerated by elevated temperatures and humidity.
高温和高湿度会加速金属去除过程。
the passivation layer helps to mitigate demetallization effects on the surface.
钝化层有助于减轻表面金属去除的影响。
post-etch demetallization is a common concern in semiconductor manufacturing.
蚀刻后的金属去除是半导体制造中常见的担忧。
understanding demetallization pathways is key to designing robust devices.
理解金属去除途径是设计坚固型器件的关键。
demetallization testing is a standard procedure in our quality control process.
金属去除测试是我们质量控制流程的标准程序。
the goal is to minimize demetallization and extend the device lifespan.
目标是尽量减少金属去除并延长器件寿命。
electromigration can contribute to demetallization in integrated circuits.
电子迁移可导致集成电路中的金属去除。
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